STEP 01
Layout Setup
Import schematic, define board stack-up, layer configuration, and design rules aligned with fabrication capabilities and electrical requirements.
STEP 02
Board Outline & Constraints
Establish mechanical outline, mounting constraints, keep-outs, and interface locations. Electrical constraints such as impedance, clearance, and creepage are defined upfront.
STEP 03
Footprint Validation & Placement
Verify footprints against datasheets and manufacturing tolerances. Placement strategy is planned based on functional blocks, signal flow, and thermal behaviour.
STEP 04
Routing Execution
Controlled impedance for high-speed lines, short return paths and proper grounding, separation of noisy and sensitive domains, and current-carrying trace sizing based on load.
STEP 05
Silkscreen & Assembly Layer
Add clear component markings, polarity indicators, and assembly references to support manufacturing and debugging.
STEP 06
Design Rules Check (DRC)
Run comprehensive DRC covering spacing, width, via constraints, and fabrication limits. All violations are resolved with manufacturability in mind.
STEP 07
Manufacturing Data Generation
Export Gerber/ODB++, drill files, pick-and-place, and assembly drawings. Outputs are validated for fabrication and assembly readiness.





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